Walter Ewag UK, a member of the United Grinding Group, has announced that the latest version of the Walter Tool Studio software with integrated wizard technology now includes an erosion function for the two-in-one Walter Helitronic tool grinding-erosion machines, for the easy and fast programming of ‘what you see you can erode’ processes of:
[] Designing and programming complex tool geometries, including individual tooth geometries and tool parameter scaling
[] Fast 3-D live simulation routines
[] Automatic collision control.
After simply selecting tool size and geometry, then grinding wheel and electrode ‘package’, the system offers a simulation mode where parameters can be quickly and easily changed before tool production starts – on the Power Diamond, Diamond Evolution and Vision Diamond 400L machines.
The new enhancements in Tool Studio version 3 – which all contribute to faster tool production simulation, parameter changes and machine operation for the production of carbide as well as PCD tooling – also embrace new functionality for:
[] Thread milling cutters – diameter/flank grinding and OD grinding
[] Pocket extensions – import and grind DXF pocket shapes
[] Cut-off operations – compensating for worn wheels
[] Probing and alignment of asymmetrical flats – more functionality to define probing points/probe the exact position for perfect alignment
[] Side probing – on the Helitronic Micro c axis at 90deg for grinding lengths up to 200 mm, depending on application and wheel diameter
[] In-process wheel and electrode measurement inside the machine
[] Core compensation for long tools – core parameter and tolerance band
[] Automatic machine axis referencing – using setting disc with electrical isolator
[] Coolant hole detection with camera
[] Integration of the new Top Loader handling
[] Integration of the optional HF (50,000 revs/min) spindle.
In addition, Tool Studio 3 has a grinding wheel data interface for the Heliset tool measuring machine, to measure wheel/wheelsets then send/import that data to Tool Studio.
